Chrome OS update will allow higher-end Chromebooks to use more memory for Linux

Here’s an interesting Chrome OS change coming up considering that I now use a Chromebook with 16 GB of RAM: A new code commit will change how memory is allocated to the Linux environment on Chromebooks with more than 4 GB of RAM. Those devices will see more memory provided to the Linux container…. a lot more, as it stands now.

The code commit description says it all and I was surprised to see that if you have more than 4 GB of memory in your Chromebook, all but 1 GB of it will go towards Linux.

I understand the specific reason noted above that would require this memory allocation change. But it seems a bit excessive when it comes to running Linux on a Chromebook with more than 4 GB of memory. Or rather, it seems like leaving just a single GB of RAM to run Chrome OS on such a device feels too limiting.

What I’d prefer to see (if anyone on the Chromium team cares about my opinion!) is a memory allocation slider in the Linux settings within Chrome OS. This way, I could choose to allocate, for example, 4 GB of memory to Chrome OS and 12 GB to the Linux container on my Acer Chromebook Spin 13 with 16 GB of memory, prior to starting up a new Linux container.

I suppose if you’re coding in Linux, you could just open up the Chromium browser, rather than use Chrome OS to read and search for development documentation.

Even so, the idea for Project Crostini as I understand it is to provide access to Linux apps within the Chrome OS platform, as in using both software platforms simultaneously. Leaving Chrome OS with a single GB of RAM, in this case, feels like it could be a bit detrimental when it comes to performance.

There’s no associated bug to file feedback on this feature change, so until there is one, there’s no way to let the Chromium team how you may feel about this. But I’m sure you’ll sound off in the comments here!

As far as timing, without an associated bug, it’s difficult to say when this change will go live on the Stable Channel. Given that the feature freeze for Chrome OS 79 passed on October 4, my educated guess is that this will be a Chrome OS 80 deliverable. However, I’ll check and confirm when the next version or two of the Stable Channel arrives.

Crucial Introduces X8 Portable SSD

Micron’s consumer brand Crucial is entering the portable SSD market with the new Crucial X8 Portable SSD. The X8 has a USB-C 10Gb/s (USB 3.1 Gen 2) connection and internally uses a NVMe SSD based on the Crucial P1 with QLC NAND flash. The Crucial X8 is intended for general-purpose consumer storage workloads that are mostly read-intensive; even though it can handle up to ~1GB/s read speeds, the use of QLC NAND means it cannot sustain high write speeds for long and videographers would be disappointed. Instead, Crucial is touting the X8 for transferring or backing up files and photos, or for expanding the storage of a video game console.

The SSD inside the X8 is based on the same hardware as the Crucial P1, but with some firmware tweaks to optimize for the expected use cases of external storage rather than as an internal OS drive. The USB to NVMe bridge chip is the ASMedia 2362. Crucial has worked with ASMedia to ensure that all the idle power management features are working behind the bridge, but the peak power draw of the whole drive still requires a USB host port that can supply 5V at up to 1.5A. The case is a combination of aluminum and plastic, and is rated to survive drops onto the floor but is not ruggedized with any water resistance or dust proof rating.

The Crucial X8 is available in 500GB and 1TB capacities. It is supplied with a USB-C to USB-C cable and a USB-C to USB-A adapter. The warranty period is only 3 years compared to the Crucial P1 SSD’s 5 year warranty, and the X8 doesn’t come with an official write endurance rating. MSRPs for the X8 are substantially higher than current prices for the P1 SSD, but are in line with MSRPs for other high-end portable SSDs: $189.99 for the 1TB and $119.99 for the 500GB model. We expect street prices to be quite a bit lower, since the P1 is currently retailing for around $96 and $67, and USB to NVMe enclosures for a DIY portable SSD are about $25.

Micron launches new hard drives to challenge Intel in data centers

SAN FRANCISCO (Reuters) – Idaho-based memory chipmaker Micron Technology <MU.O> on Thursday challenged rival Intel Corp <INTC.O> with a new line of hard drives aimed at data centers, just as the two companies are on the cusp of formally ending a joint venture of more than a decade that developed the technology.

Micron and Intel worked together starting in 2006 to bring to market what is called 3D cross-point memory technology. The technology uses three-dimensional features on storage chips to make them faster.

Micron said a year ago that it would buy out Intel’s share of the joint venture, called IM Flash Technologies, for $1.5 billion (£1.17 billion)

in cash and the assumption of $1 billion of Intel’s share of the venture’s debt. The deal will close this month, leaving Micron in full control of a factory built in Utah to make the chips.

Hard drives made with the new chips are faster than previous solid-state drives. That has captured the interest of data center owners carrying out computing jobs like deep learning, where artificial intelligence software ingests huge amounts of data to learn new tasks.

Intel released a second generation of its version of the technology earlier this year. Micron is now jumping into the market, testing it with what a handful of customers.

“This is just the very, very beginning,” Micron Chief Executive Sanjay Mehrotra told Reuters at a launch event in San Francisco. “These kinds of technologies do take multiple years before are they broadly deployed.”

Micron launched its Intel competitor Thursday, a device it calls X100. The device itself is a hard drive that can be plugged directly into a server, and Micron claims it is faster than its rival due in part to a piece of technology called a controller that take instructions from the server’s computing brain about which data to read or write on the hard drive.

Micron developed the controllers internally and is hoping they will set its products apart in the memory market, where supply and demand dynamics can produce dramatic shifts in prices.

Mehrotra’s strategy since taking over as chief executive in 2017 has been to increase the number of storage products that include technologies beyond just commodity memory chips. About half of the company’s storage revenue now comes from such products, versus 20% when he arrived, he said.

“This is hugely attractive,” Mehrotra said of differentiating features. “We are making strong progress there.”

x86 PC Smaller than an iPhone: GIGABYTE’s GA-PICO3350 with an Apollo Lake CPU

Hidden underneath the mass of news is a new small Pico-ITX based SoC motherboard from GIGABYTE, the GA-PICO3350. Smaller than the latest iPhone 11 smartphone, the GIGABYTE GA-PICO3350 is 100 x 72 mm and includes an Intel Celeron N3350 Apollo Lake SoC processor, with a single SO-DIMM DDR3L slot, and a Realtek ALC887 HD audio codec.

Slightly larger than a Raspberry Pi 3 B+, the new Pico-ITX sized GIGABYTE GA-PICO3350 is based on Intel’s Apollo Lake SoC with an Intel Celeron N3350 dual-core processor which has a base core frequency of 1.1 GHz, with a burst frequency of 2.4 GHz with a TDP of just 6 W. Users can install up to 8 GB of DDR3L-1866 memory into the single SO-DIMM slot, with a single SATA port and single MSATA PCIe connector. The Realtek ALC887 HD audio codec offers two-channels over the front panel header. It also includes plenty of other connectors including a serial port header, an LCDVVC/MON, an LVDS, GPIO, SMBus, and battery cable header.

On the rear panel are a single DC power input, an HDMI port, two USB 3.0 Type-A ports, and a single Ethernet port powered by an unknown Realtek Gigabit Ethernet controller. The GIGABYTE GA-PICO3350 does include a single M.2 slot on the PCB for users wishing to install a wireless interface which does share bandwidth with the MSATA PCIe connector.

Currently, there is no pricing and availability information available for GIGABYTE’s GA-PICO3350, but we did locate it for sale without a price on German etailer Rosch Computer’s website.

Pick up this XPS Tower with a GTX 1660 for less than $700 from Dell

Looking for a cheap gaming desktop deal? Dell’s had a recent string of killer deals on a number of their desktops and laptops. This XPS Tower normally goes for $1,099.99, but Dell is slashing the price down to $685, courtesy of this killer coupon code: XPSDTAFF0. That’s a $400 savings for a solid 1080p budget system.

The XPS Tower has an Intel Core i5-9400, 8GB RAM (upgradable to 64 GB), 1TB HDD, and a GTX 1660—a nice build for budget gamers who still want the room to upgrade. You can play all your favorite games in 1080p at medium presets without major issues. A larger SSD instead of the 256GB one in the build would have been great, but for under $700 that’s still a good list of components.

What we like about the XPS Tower is how upgrade friendly it is. It uses a swing-out power supply (meaning it literally swings out of the case) that lets you easily upgrade your rig without any tools, and with enough room if you want to upgrade to one of the best graphic cards.

At this price, you can easily upgrade this rig with more RAM or a newer, better graphics card with the money you save for Black Friday. We will be painstakingly tracking all the best deals.

Hands-on with a new foldable phone concept that’s the largest and most daring yet

I’ve opened and closed foldable phones hundreds of times by now. But even after reviewing the Galaxy Fold (twice), playing with Huawei’s Mate X and bending slim concept designs, nothing has prepared me for TCL’s prototype dual-hinged phone, which folds in three parts and opens into a huge, 10-inch tablet.

The most remarkable thing about TCL’s phone is that the hinges themselves move in different directions. The DragonHinge fold in, like a book, or like the Galaxy Fold, while the Butterfly Hinge folds the opposite way.

The two hinges create a zigzag shape as you open and close the device, a silhouette in Z. It looks like an accordion. Or a taco holder. And I have to get my greedy hands on it to give it a fold, one panel at a time: Open. Folded over once. Completely folded up into a triple-stacked sandwich so that the exposed panel becomes the TCL phone’s “outer” screen. With this design, a single uninterrupted screen does it all.

As with other foldable phones, the act of folding feels physical and visceral in a way that makes me appreciate the engineering feat of any company attempting to make devices whose screens bend in half.

Foldable phones are the next frontier in phone design, delivering at least double the screen space in a package that’s practical enough to tote around. Unfolded, the large screens promise an expansive display for reading, watching videos, gaming and multitasking. Folded up, you can use them on the go. Despite very real fears over screen damage that could send lofty foldable ambitions crashing to the ground, device-makers are scrambling to push out their own new designs — to bag reputation points as much as to capture buyers’ attention.

It’s into this mix that TCL is dropping its wild new prototype. Best known for making really good, affordable TVs, TCL is now aligning its phone business under the same brand. The company has already trotted out concept designs and announced its DragonHinge months before this particular dual-hinge effort.

TCL’s daring trifold prototype is just the start

TCL’s prototype design doesn’t have a name, a price or a target window for production. It doesn’t even have a working screen. All that will come. For now, I’m mesmerized as I work the hinges with my hands, and imagine what it’d be like to use a triply folding device.

Folding one panel under, for example, could turn a portion of the screen into a digital keyboard while you use another part as the display. When you fully close the phone, you’d be able to use it as a really chunky handset.

Yes, you’ll see creases when it’s open — and no, we still don’t have bendable glass to better protect the display. That raises questions about the wear and tear on a device with a plastic cover material that’s exposed to sharp objects, damage from pressure and the elements, like rain and dust. These are the same issues that plagued the $1,980 Galaxy Fold and spurred Samsung to retrofit its foldable phone to make it sturdier than its first attempt.

For now, there’s no consensus on what the “best” foldable phone design is, and that’s what makes this all so exciting. We’re in the Wild West phase where any prototype or concept goes, from the vertically folding Motorola Razr that CNET discovered will come out by the end of 2019, to the square foldable phone that Samsung’s rumored to be building.

Microsoft, too, has its bookish Surface Pro Duo slated for 2020 and Chinese brand Xiaomi wowed us with an early concept that has you folding back two side display panels behind a center panel.

When and if it becomes a real product, TCL’s prototype will face distinct challenges with ensuring sturdy construction, a semiaffordable price and a sales plan to put the biggest foldable phone we’ve seen yet in front of real buyers. But enough reality for now. I let the teeming questions slide from my mind and give the Butterfly Hinge one more fold.

TCL trifold phone specs we know so far

Roughly 10-inch screen when fully opened

Four rear cameras

Front-facing camera

USB-C charger port

Iridescent finish

No headphone jack

Intel Unveils 10nm Atom Tremont Microarchitecture

Intel pulled back the veil on its 10nm Tremont Atom architecture today at the Linley Fall Processor Conference. Intel’s ULP (ultra-low power) architectures don’t grab the flashbulbs like its venerable Core series of chips, but Atom processors power an untold number of low-power devices, like micro-servers, tablets, and Internet of Things (IoT) equipment. These segments still serve as a bastion for Intel, as AMD doesn’t have competitive chips to tackle these areas.

Intel’s move to the 10nm Atom Tremont architecture begins with a focus on single-threaded performance but also brings other big improvements to bear, like the addition of L3 cache, a first for Atom, new power management enhancements that complement improved performance-per-watt, bolstered security, and support for new instructions.

Intel claims the culmination of these efforts results in up to 30% more IPC (at ISO frequencies) for Tremont compared to the previous-gen Goldmont Plus architecture (SPEC). Unfortunately, Intel isn’t revealing its clock speeds yet, so the increased IPC may give it room to accommodate lower frequencies that come as a byproduct of the new and yet-to-be-refined 10nm process, much like we see with Ice Lake processors.

Intel’s coming 3D-stacked Lakefield processors, like seen in Microsoft’s Surface Neo devices, will feature four low-power Tremont cores paired with one high-performance Sunny Cove core in a hybrid approach glued together with Foveros technology. This approach allows Intel to offer an incredible amount of processing power at low power in ultra-dense designs.

This approach allows Intel to meld together two different architectures to capitalize on the low-power and efficiency of the Tremont Atom cores and the high performance of the Sunny Cove core, thus creating a combination similar to an ARM big.LITTLE processor, which Intel calls a “hybrid x86 architecture.”

But behind this blending of two distinct architectures to enable new levels of performance density and power efficiency lies the Tremont architecture, which will also find its way into numerous other processors in traditional form factors. Let’s take a closer look at Intel’s first 10nm low-power processing cores.

Intel Tremont Single-Threaded Performance

Intel’s overarching design targets include a focus on single-threaded performance paired with improved power efficiency and performance density for the networking components that tie the various compute elements together.

Intel beefed up Tremont’s branch predictor to what it calls “Core-class” levels of performance, meaning the Atom cores will have nearly the same accuracy as their high-power Sunny Cove Core family counterparts. This is accomplished with a new dual-stage branch prediction implementation, though Intel isn’t specifying which types of predictors it is using (TAGE is a likely suspect for the second stage).

The architecture can decode up to six out-of-order x86 instructions, and features four-wide allocation and retire, along with dual load/store pipelines.

The chips will come with four-core modules that share an L2 cache that can be up to 4.5MB, but will vary based on specific products.

Intel Tremont Front End (Fetch, Predict, Decode)

Bits flow into the branch prediction unit (predict), which issues addresses to the Fetch unit, which then loads the instruction cache. This feeds the dual instruction data units that flush to dual 3-wide decode units.

Tremont features path-based prediction on “fairly long” histories, looking for a taken branch on the first 32 bytes of a 64-byte cacheline, but will jump to the second 32 bytes if it can’t find a branch in the first half of the cacheline.

The predictor has two levels, with the first being penalty-free, while the larger second-level predictor has a two-cycle penalty. Predictions are handed off to the out-of-order fetch that has a 32KB instruction cache and can issue 32 bytes per cycle.

Decode can process up to six x86 instructions per cycle with two different banks of symmetric complex decoders, meaning all decoders have the capability to process the same instructions. This brings wide native decode capabilities to the architecture without using a micro-op cache, a simplification that equates to die area savings. This also allows the option to run the decoders in parallel, or restricted to save power. The four-wide allocation/rename unit then feeds the integer execution unit.

Intel Tremont Integer and Vector Execution

Here we can see the improvements that Intel has made to the integer and vector units. The architecture features a larger 208-entry out of order window to accommodate the increased width, which in turn maximizes parallelism to the execution units. Six reservation stations (most tied to a single end port) feed the three ALU, two AGU (address generation unit), jump, and store ports.

Intel improved crypto-acceleration in the vector unit by integrating dual 128-bit AES units with a four cycle latency, and a single-instruction SHA256 support with a four cycle latency, along with support for new Galois Field instructions.

Vector processing has two SIMD units and two AES units split among two execution ports. Intel also added a floating point multiplier on one of those ports, and an adder on the other port, which allows parallel multiply, add, and store operations.

Intel Tremont Memory Subsystem and New Instructions

The memory subsystem can dispatch two loads and stores down the pipeline per cycle. The 8-way 32KB data cache has a three cycle load-to-use latency. The five-entry second-level TLB handles requests from both instruction and data cache.

The L2 cache is shared between one to four ports, with 1.5MB to 4.5MB options. Intel also added an L3 cache that can be either inclusive or non-inclusive. The L3 cache enables tying Tremont to other Intel fabrics, like we see with the combination of Sunny Cove and Tremont cores in Lakefield. Intel also added support for Intel Resource Director technology to enable slicing up the cache to enforce fairness or memory bandwidth requirements in either L2 or L3 cache.

Tremont has no specific L3 cache capacity requirements or specifications, instead that is dictated by the particular SoC implementation.

Intel also added new networking- and accelerator-specific instructions, like move-direct instructions that allow traffic optimizations to end points, like the aforementioned networking additives and accelerators. Intel also added secure boot, trusted execution technology, and total memory encryption. Intel also tells us that some of the in-silicon mitigations for recent vulnerabilities have wormed their way into the new silicon, but didn’t specify which mitigations are present.

Intel also added Speed Shift technology, which is also present in Kaby and Coffee Lake processors, to speed up power state transitions from idle states by allowing the hardware to control state changes, as opposed to relying upon the operating system to dictate those transitions.

Thoughts

Overall the new Tremont architecture looks impressive and should equate to a new level of performance in the low-power space. However, Intel hasn’t shared any detailed plans of forthcoming SoC’s with the new cores, so beyond Lakefield, there isn’t any indication of when these devices will come to market. We do know that the forthcoming Gemini Lake refresh still uses the Goldmont Plus architecture, so we shouldn’t expect Tremont cores to land in that space any time soon.

As we’ve seen with Intel’s 10nm Ice Lake processors, a big jump in IPC doesn’t necessarily equate to massive overall performance gains due to the restricted clock speeds of the still-developing 10nm process node. That leaves the jury out on overall performance of the new designs, at least until silicon lands in our labs.

ASUS Chromebook Flip C434 vs. Pixelbook Go: Which should you buy?

2019 has been a good year for powerful Chromebooks. Since the ASUS C434 has been out a few months already, we can say it is 100% worth purchasing over the Pixelbook Go outside of some niche cirumcstances. Here’s why the C434 may not be the sexier Chromebook, but it’s definitely the better one to buy.

Function and form: ASUS has both

Let’s talk design philosophy for a moment here: the Google Pixelbook is a softer, rounder, more kind-looking Chromebook with warm colors and a simplified design with only one or two ports on each side. It’s a good laptop to use out in public, like at the library or Starbucks, but if you’re using it in bed or on the couch, you may run into the limits of that clamshell hinge. On the other hand, the ASUS C343 is all hard angles and bold lines, with a bevy of ports on each side and a uniquely swinging 360 2-in-1 hinge.

The C434’s sometimes awkward hinge angles can give the Pixelbook Go an edge if you tend to use your Chromebook in laptop mode with the lid extended between about 90-120 degrees. However, if you use stand or tent mode half as often as I do, the C434’s 2-in-1 hinge still takes the cake since it allows you to fold it back into a super-sized tablet when needed.

Despite the Pixelbook’s screen being almost an inch smaller than the C434’s, there’s less than a half-inch difference between the footprint of the two laptops thanks to how well ASUS squeezes bezels around its screen. The C434 is heavier, but that’s expected since it sports a larger screen and larger battery.

Switching over to the internals, the specs on the C434 and Go are mostly the same. The Go has larger RAM and storage options, as well as a 4K display option if you’re willing to go up to the $1,400 top-end model. However, the C434 has a USB-A port and a microSD card slot, both things that are sorely missed on the Pixelbook Go.

It’s still mind-boggling that the only Chromebooks to lack microSD and USB-A are some of the most expensive around — the Pixelbook and a Pixelbook Go. It’s also confusing the Google released a clamshell laptop in 2019 when 2-in-1s rule the Chromebook space and much of the laptop market at large right now.

The Pixelbook Go is pretty, but it’s just impractical unless you fall into one of three camps:

You only want to use a Chromebook in laptop mode and want the laptop to sit flat while you do.

You want a 4K screen without lugging around a 4.5 pound behemoth like the Lenovo C630 (and you’re willing to pay $1,400 for it).

You want the latest Chromebook features and updates before any other Chromebook gets them.

Otherwise, go with the ASUS. Your wallet and sanity will thank you.

Micron Finally Rolls 3D XPoint SSD: X100 Billed as ‘World’s Fastest’ with 2.5 Million IOPS and 9 GBps

Micron announced its X100 SSD today, which its bills as the world’s fastest SSD with 9GB/s of sequential performance in both read, write, and mixed workloads, and up to 2.5 million random IOPS.

Micron touts the new PCIE 3.0 x16 device as delivering an impressive 8 microseconds of latency, which is faster than Intel’s claimed 10 microseconds of latency from its Optane SSDs. The SSD is also notably faster at sequential and random performance than any of Intel’s competing Optane devices.

Intel and Micron co-developed the revolutionary 3D XPoint storage media, which blends “DRAM-like” performance with a much lower price point and persistence (data remains on the storage device after power is removed). After the initial announcement in 2015, Intel went on to develop a wide range of 3D XPoint-powered devices, branded Optane, that encompass both storage and memory devices.

Micron initially announced QuantX, a series of high-performance SSDs that promised to upend the enterprise storage market, in 2016, but those drives never made it to market. In the interim, Micron and Intel have parted ways on joint 3D XPoint development, leaving Micron with no vehicle to sell it own 3D XPoint-infused devices on the open market.

That changes today with the debut of Micron’s X100 SSD. Here are the product highlights:

High-performance local storage – offers up to 2.5 million input/output operations per second (IOPs), more than three times faster than today’s competitive SSD offerings

Industry’s highest bandwidth – has more than 9GB/s bandwidth in read, write and mixed modes and is up to three times faster than today’s competitive NAND offerings

Ultralow latency – provides consistent read-write latency that is 11 times better than NAND SSDs

Application acceleration – enables two to four times the improvements in end-user experience for various applications with prevalent data center workloads

High-performance in small size storage – eliminates the need for overprovisioning storage for performance

Ease of adoption – because the Micron X100 SSD uses the standard NVMe interface, requires no changes to software to receive the full benefits of the product

The back of the card reveals 16 emplacements for 3D XPoint packages, but it isn’t clear if the SSD uses the first generation of the memory, or the soon-to-arrive second generation.

We also see the X100 has an auxiliary 8-pin power connector, which means this drive will consume quite a bit of power. The cooling solution is passive and designed to take advantage of the linear airflow in servers. Micron isn’t sharing specifics of its controller, though we are told it is a proprietary design.

Unfortunately, Micron’s X100 series is aimed at the data center for now, meaning we won’t see an equivalent for the desktop market in the near term. However, with Micron now finally making headway on its own 3D XPoint-infused SSDs, we hope that will change in the future. Micron says it is sampling the drives to early customers now, but hasn’t shared information about the various capacity points or pricing. 

AOC is launching a fast 27-inch FreeSync 2 HDR monitor next month for £439

AOC is getting ready to expand its growing gaming monitor lineup with a high refresh rate model, the Agon AG273QX. It’s a 27-inch display with a VA panel capable of up to 165Hz at 1440p.

This is also a certified FreeSync 2 HDR monitor. As such, it supports variable refresh rates to keep the action in sync with your Radeon GPU for smoother gameplay, and technically supports HDR content.

I stay “technically” because the brightness level peaks at 400 nits. That’s enough to qualify for VESA’s entry-level DisplayHDR 400 certification, but for LCD monitors, brightness plays a big role in the quality of HDR content—a monitor with a 1,000 nits peak brightness is going to outshine this display.

Brightness aside, the overall specs look good for a gaming display. Here’s a quick and dirty rundown of the pertinent details:

Size—27 inches

Panel—VA w/ 90 percent coverage of the DCI-P3 color space

Resolution—2560×1440 resolution

Refresh rate—165Hz

Response time—1ms MPRT

Inputs—2x DisplayPort 1.2, 1x mini DisplayPort, 2x HDMI 2.0

Connectivity—4x USB 3.0 Type A, 2x USB 3.0 Type B

Audio—2x 5W speakers

The display allows users to make pivot, tilt, swivel, and height (up to 110mm) adjustments. It can also be mounted to a wall via VESA 75×75 monitor mounts.

Not to be confused with the AG273QCX, which is also a 27-inch monitor but with a 144Hz refresh rate, the faster AG273QX (there’s no “C” in the model name) will launch at £439 in the UK in November, according to Overclock3D. There’s no mention of when it will be available in other territories.

It’s also worth noting that AOC recently bolstered its warranty coverage, albeit just in the US. The overall warranty period on its premium Agon models is 4 years and includes a zero dead pixel guarantee, along with an advanced replacement service and accidental damage protection for the first year of ownership (good for a single replacement claim).