Intel Unveils 10nm Atom Tremont Microarchitecture

Intel pulled back the veil on its 10nm Tremont Atom architecture today at the Linley Fall Processor Conference. Intel’s ULP (ultra-low power) architectures don’t grab the flashbulbs like its venerable Core series of chips, but Atom processors power an untold number of low-power devices, like micro-servers, tablets, and Internet of Things (IoT) equipment. These segments still serve as a bastion for Intel, as AMD doesn’t have competitive chips to tackle these areas.

Intel’s move to the 10nm Atom Tremont architecture begins with a focus on single-threaded performance but also brings other big improvements to bear, like the addition of L3 cache, a first for Atom, new power management enhancements that complement improved performance-per-watt, bolstered security, and support for new instructions.

Intel claims the culmination of these efforts results in up to 30% more IPC (at ISO frequencies) for Tremont compared to the previous-gen Goldmont Plus architecture (SPEC). Unfortunately, Intel isn’t revealing its clock speeds yet, so the increased IPC may give it room to accommodate lower frequencies that come as a byproduct of the new and yet-to-be-refined 10nm process, much like we see with Ice Lake processors.

Intel’s coming 3D-stacked Lakefield processors, like seen in Microsoft’s Surface Neo devices, will feature four low-power Tremont cores paired with one high-performance Sunny Cove core in a hybrid approach glued together with Foveros technology. This approach allows Intel to offer an incredible amount of processing power at low power in ultra-dense designs.

This approach allows Intel to meld together two different architectures to capitalize on the low-power and efficiency of the Tremont Atom cores and the high performance of the Sunny Cove core, thus creating a combination similar to an ARM big.LITTLE processor, which Intel calls a “hybrid x86 architecture.”

But behind this blending of two distinct architectures to enable new levels of performance density and power efficiency lies the Tremont architecture, which will also find its way into numerous other processors in traditional form factors. Let’s take a closer look at Intel’s first 10nm low-power processing cores.

Intel Tremont Single-Threaded Performance

Intel’s overarching design targets include a focus on single-threaded performance paired with improved power efficiency and performance density for the networking components that tie the various compute elements together.

Intel beefed up Tremont’s branch predictor to what it calls “Core-class” levels of performance, meaning the Atom cores will have nearly the same accuracy as their high-power Sunny Cove Core family counterparts. This is accomplished with a new dual-stage branch prediction implementation, though Intel isn’t specifying which types of predictors it is using (TAGE is a likely suspect for the second stage).

The architecture can decode up to six out-of-order x86 instructions, and features four-wide allocation and retire, along with dual load/store pipelines.

The chips will come with four-core modules that share an L2 cache that can be up to 4.5MB, but will vary based on specific products.

Intel Tremont Front End (Fetch, Predict, Decode)

Bits flow into the branch prediction unit (predict), which issues addresses to the Fetch unit, which then loads the instruction cache. This feeds the dual instruction data units that flush to dual 3-wide decode units.

Tremont features path-based prediction on “fairly long” histories, looking for a taken branch on the first 32 bytes of a 64-byte cacheline, but will jump to the second 32 bytes if it can’t find a branch in the first half of the cacheline.

The predictor has two levels, with the first being penalty-free, while the larger second-level predictor has a two-cycle penalty. Predictions are handed off to the out-of-order fetch that has a 32KB instruction cache and can issue 32 bytes per cycle.

Decode can process up to six x86 instructions per cycle with two different banks of symmetric complex decoders, meaning all decoders have the capability to process the same instructions. This brings wide native decode capabilities to the architecture without using a micro-op cache, a simplification that equates to die area savings. This also allows the option to run the decoders in parallel, or restricted to save power. The four-wide allocation/rename unit then feeds the integer execution unit.

Intel Tremont Integer and Vector Execution

Here we can see the improvements that Intel has made to the integer and vector units. The architecture features a larger 208-entry out of order window to accommodate the increased width, which in turn maximizes parallelism to the execution units. Six reservation stations (most tied to a single end port) feed the three ALU, two AGU (address generation unit), jump, and store ports.

Intel improved crypto-acceleration in the vector unit by integrating dual 128-bit AES units with a four cycle latency, and a single-instruction SHA256 support with a four cycle latency, along with support for new Galois Field instructions.

Vector processing has two SIMD units and two AES units split among two execution ports. Intel also added a floating point multiplier on one of those ports, and an adder on the other port, which allows parallel multiply, add, and store operations.

Intel Tremont Memory Subsystem and New Instructions

The memory subsystem can dispatch two loads and stores down the pipeline per cycle. The 8-way 32KB data cache has a three cycle load-to-use latency. The five-entry second-level TLB handles requests from both instruction and data cache.

The L2 cache is shared between one to four ports, with 1.5MB to 4.5MB options. Intel also added an L3 cache that can be either inclusive or non-inclusive. The L3 cache enables tying Tremont to other Intel fabrics, like we see with the combination of Sunny Cove and Tremont cores in Lakefield. Intel also added support for Intel Resource Director technology to enable slicing up the cache to enforce fairness or memory bandwidth requirements in either L2 or L3 cache.

Tremont has no specific L3 cache capacity requirements or specifications, instead that is dictated by the particular SoC implementation.

Intel also added new networking- and accelerator-specific instructions, like move-direct instructions that allow traffic optimizations to end points, like the aforementioned networking additives and accelerators. Intel also added secure boot, trusted execution technology, and total memory encryption. Intel also tells us that some of the in-silicon mitigations for recent vulnerabilities have wormed their way into the new silicon, but didn’t specify which mitigations are present.

Intel also added Speed Shift technology, which is also present in Kaby and Coffee Lake processors, to speed up power state transitions from idle states by allowing the hardware to control state changes, as opposed to relying upon the operating system to dictate those transitions.

Thoughts

Overall the new Tremont architecture looks impressive and should equate to a new level of performance in the low-power space. However, Intel hasn’t shared any detailed plans of forthcoming SoC’s with the new cores, so beyond Lakefield, there isn’t any indication of when these devices will come to market. We do know that the forthcoming Gemini Lake refresh still uses the Goldmont Plus architecture, so we shouldn’t expect Tremont cores to land in that space any time soon.

As we’ve seen with Intel’s 10nm Ice Lake processors, a big jump in IPC doesn’t necessarily equate to massive overall performance gains due to the restricted clock speeds of the still-developing 10nm process node. That leaves the jury out on overall performance of the new designs, at least until silicon lands in our labs.

ASUS Chromebook Flip C434 vs. Pixelbook Go: Which should you buy?

2019 has been a good year for powerful Chromebooks. Since the ASUS C434 has been out a few months already, we can say it is 100% worth purchasing over the Pixelbook Go outside of some niche cirumcstances. Here’s why the C434 may not be the sexier Chromebook, but it’s definitely the better one to buy.

Function and form: ASUS has both

Let’s talk design philosophy for a moment here: the Google Pixelbook is a softer, rounder, more kind-looking Chromebook with warm colors and a simplified design with only one or two ports on each side. It’s a good laptop to use out in public, like at the library or Starbucks, but if you’re using it in bed or on the couch, you may run into the limits of that clamshell hinge. On the other hand, the ASUS C343 is all hard angles and bold lines, with a bevy of ports on each side and a uniquely swinging 360 2-in-1 hinge.

The C434’s sometimes awkward hinge angles can give the Pixelbook Go an edge if you tend to use your Chromebook in laptop mode with the lid extended between about 90-120 degrees. However, if you use stand or tent mode half as often as I do, the C434’s 2-in-1 hinge still takes the cake since it allows you to fold it back into a super-sized tablet when needed.

Despite the Pixelbook’s screen being almost an inch smaller than the C434’s, there’s less than a half-inch difference between the footprint of the two laptops thanks to how well ASUS squeezes bezels around its screen. The C434 is heavier, but that’s expected since it sports a larger screen and larger battery.

Switching over to the internals, the specs on the C434 and Go are mostly the same. The Go has larger RAM and storage options, as well as a 4K display option if you’re willing to go up to the $1,400 top-end model. However, the C434 has a USB-A port and a microSD card slot, both things that are sorely missed on the Pixelbook Go.

It’s still mind-boggling that the only Chromebooks to lack microSD and USB-A are some of the most expensive around — the Pixelbook and a Pixelbook Go. It’s also confusing the Google released a clamshell laptop in 2019 when 2-in-1s rule the Chromebook space and much of the laptop market at large right now.

The Pixelbook Go is pretty, but it’s just impractical unless you fall into one of three camps:

You only want to use a Chromebook in laptop mode and want the laptop to sit flat while you do.

You want a 4K screen without lugging around a 4.5 pound behemoth like the Lenovo C630 (and you’re willing to pay $1,400 for it).

You want the latest Chromebook features and updates before any other Chromebook gets them.

Otherwise, go with the ASUS. Your wallet and sanity will thank you.

Micron Finally Rolls 3D XPoint SSD: X100 Billed as ‘World’s Fastest’ with 2.5 Million IOPS and 9 GBps

Micron announced its X100 SSD today, which its bills as the world’s fastest SSD with 9GB/s of sequential performance in both read, write, and mixed workloads, and up to 2.5 million random IOPS.

Micron touts the new PCIE 3.0 x16 device as delivering an impressive 8 microseconds of latency, which is faster than Intel’s claimed 10 microseconds of latency from its Optane SSDs. The SSD is also notably faster at sequential and random performance than any of Intel’s competing Optane devices.

Intel and Micron co-developed the revolutionary 3D XPoint storage media, which blends “DRAM-like” performance with a much lower price point and persistence (data remains on the storage device after power is removed). After the initial announcement in 2015, Intel went on to develop a wide range of 3D XPoint-powered devices, branded Optane, that encompass both storage and memory devices.

Micron initially announced QuantX, a series of high-performance SSDs that promised to upend the enterprise storage market, in 2016, but those drives never made it to market. In the interim, Micron and Intel have parted ways on joint 3D XPoint development, leaving Micron with no vehicle to sell it own 3D XPoint-infused devices on the open market.

That changes today with the debut of Micron’s X100 SSD. Here are the product highlights:

High-performance local storage – offers up to 2.5 million input/output operations per second (IOPs), more than three times faster than today’s competitive SSD offerings

Industry’s highest bandwidth – has more than 9GB/s bandwidth in read, write and mixed modes and is up to three times faster than today’s competitive NAND offerings

Ultralow latency – provides consistent read-write latency that is 11 times better than NAND SSDs

Application acceleration – enables two to four times the improvements in end-user experience for various applications with prevalent data center workloads

High-performance in small size storage – eliminates the need for overprovisioning storage for performance

Ease of adoption – because the Micron X100 SSD uses the standard NVMe interface, requires no changes to software to receive the full benefits of the product

The back of the card reveals 16 emplacements for 3D XPoint packages, but it isn’t clear if the SSD uses the first generation of the memory, or the soon-to-arrive second generation.

We also see the X100 has an auxiliary 8-pin power connector, which means this drive will consume quite a bit of power. The cooling solution is passive and designed to take advantage of the linear airflow in servers. Micron isn’t sharing specifics of its controller, though we are told it is a proprietary design.

Unfortunately, Micron’s X100 series is aimed at the data center for now, meaning we won’t see an equivalent for the desktop market in the near term. However, with Micron now finally making headway on its own 3D XPoint-infused SSDs, we hope that will change in the future. Micron says it is sampling the drives to early customers now, but hasn’t shared information about the various capacity points or pricing. 

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Step 2: Check battery’s appearance and interface.
Step 3: Test battery charger and recharger function.
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Step 5: Use Ev2300 to check the voltage difference of each goroup cells.
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11.1V/12.4v 2300mah BOSE 404600 for Bose SOUNDLINK I II III7.4V 2230mAH/17Wh BOSE 063404 for BOSE SOUNDLINK Mini I Series3.8 V 1300 mAh AMAZON MC-305070 for AMAZON Kindle Voyage3.8V 2930mAh/11.1Wh NETGEAR W-7 for Netgear AirCard 790S 790SP 8103.85V/4.4V 3080MAH/11.86WH ALCATEL TLp030JC for Alcatel A3 XL 9008j3.8V 4000mAh/15.2Wh LENOVO L15D1P31 for Lenovo Yoga Tab3 Pro YT3-X90L11.4V 84Wh DELL 4GVGH for DELL XPS 15 9550 4GVGH 1P6KD7.68V 38Wh/4955mAh LENOVO BSNO4170A5-AT for Lenovo 5B10L68713 5B10L67278 L7.7V 37Wh/4810mAh ACER AP16M5J for ACER A315-51-51SL N17Q1 SERIES3.8V/4.35V 4250mAh/16.2WH LENOVO L15D1P32 for Lenovo Tab 3 8 Plus TB-8703F 8

AOC is launching a fast 27-inch FreeSync 2 HDR monitor next month for £439

AOC is getting ready to expand its growing gaming monitor lineup with a high refresh rate model, the Agon AG273QX. It’s a 27-inch display with a VA panel capable of up to 165Hz at 1440p.

This is also a certified FreeSync 2 HDR monitor. As such, it supports variable refresh rates to keep the action in sync with your Radeon GPU for smoother gameplay, and technically supports HDR content.

I stay “technically” because the brightness level peaks at 400 nits. That’s enough to qualify for VESA’s entry-level DisplayHDR 400 certification, but for LCD monitors, brightness plays a big role in the quality of HDR content—a monitor with a 1,000 nits peak brightness is going to outshine this display.

Brightness aside, the overall specs look good for a gaming display. Here’s a quick and dirty rundown of the pertinent details:

Size—27 inches

Panel—VA w/ 90 percent coverage of the DCI-P3 color space

Resolution—2560×1440 resolution

Refresh rate—165Hz

Response time—1ms MPRT

Inputs—2x DisplayPort 1.2, 1x mini DisplayPort, 2x HDMI 2.0

Connectivity—4x USB 3.0 Type A, 2x USB 3.0 Type B

Audio—2x 5W speakers

The display allows users to make pivot, tilt, swivel, and height (up to 110mm) adjustments. It can also be mounted to a wall via VESA 75×75 monitor mounts.

Not to be confused with the AG273QCX, which is also a 27-inch monitor but with a 144Hz refresh rate, the faster AG273QX (there’s no “C” in the model name) will launch at £439 in the UK in November, according to Overclock3D. There’s no mention of when it will be available in other territories.

It’s also worth noting that AOC recently bolstered its warranty coverage, albeit just in the US. The overall warranty period on its premium Agon models is 4 years and includes a zero dead pixel guarantee, along with an advanced replacement service and accidental damage protection for the first year of ownership (good for a single replacement claim).

It’s Refresh Time For Intel’s Gemini Lake CPUs

FanlessTech, the source for news on miniature PCs, has published the purported specifications for Intel’s Gemini Lake Refresh (GLK-R) processors. The refreshed chips are rumored to come out next November, and you’ll probably start to find them in budget and low-power desktops and laptops.

The original Gemini Lake (GLK) chips are built on Intel’s 14nm process node and feature the chipmaker’s Goldmont Plus microarchitecture. Gemini Lake Refresh will most likely follow suit, but we do expect the new processors to arrive with higher clock speeds.

The Pentium Silver J5040 and Celeron J4125 exhibit 500 MHz higher base clock and 400 MHz and 200 MHz higher boost clocks, respectively, in comparison to their antecessors. The Celeron J4025 only shows a 200 MHz boost clock upgrade.

In regards to the 6W models, they seem to have the same base clocks of the previous generation. The Pentium Silver N5030 boasts a 400 MHz boost clock increase while the Celeron N4120 and Celeron N4020 upgrades are limited to 200 MHz.

The amount of cache should be the same 4MB across all Gemini Lake Refresh models. Since FanlessTech didn’t share the specifications for the processors’ iGPUs, we’re uncertain if they will also get beefed up by Intel. Our hunch says yes, but we’ll have to wait until Intel formally launches Gemini Lake Refresh to really be sure.